First, the epoxy resin and curing agent
Epoxy resins are those containing a (two or more) epoxy compounds, the most commonly used, yield the largest and most varied of the epoxy resin is bisphenol A type epoxy resin (also called common type, general type), other are collectively referred to as special epoxy resin, epoxy resin is generally the usual phenolic (bisphenol A, etc.) and other active hydrogen containing material and epichlorohydrin (ECH) in caustic soda (NaOH) under the action made.
Epoxy resin generally can not be used alone (except for some plastic on the outside as a plasticizer and light dose), must contain active hydrogen atoms is known as curing agents generate insoluble material after reaction with a variety of non-financial performance known as cured (Japan and Taiwan to become hardened material) before playing its various properties. Curing agents include amines, anhydrides, phenolic resins, amines and modified materials generally used in the coatings, adhesives, civil engineering, etc., acid anhydride is generally used as a casting material (transformers, transformer), the encapsulation of electronic components materials, phenolic resin is generally used in electronic on: CCL and plastic materials. CCL is the most used dicyandiamide (DICY).
Second, the development status of China
Epoxy resin production has increased annually by 10 million tons in 2000 to 2009, 63 tons; self-sufficiency rate of increase, imports of 260,000 tons in 2005 down to 2009 to 23.5 million tons. Domestic epoxy resin is mainly used for coating (47%), electrical and electronic (42%), adhesives (11%).
Third, an epoxy resin (direct resin)
1, liquid bisphenol A epoxy resin
Liquid bisphenol A type epoxy resin of the grain known to the raw materials can be processed into a variety of products with specific properties (secondary processing product or compound type), mainly used in electronic Electrical (copper clad laminate, potting material, casting material), wind power resin (a bisphenol F type epoxy resin with a part), composite materials, coatings, adhesives (including solid bisphenol A).
2, linear phenolic epoxy resin
Characterized by high heat resistance, high toughness, low viscosity, strength and toughness, mainly used for CCL (mainly halogen-free, phosphorus-containing epoxy resin copper clad laminate), composite materials. With the present formulation technology, production of 1 ton is about 0.5 tons of phosphorus-containing epoxy phenolic resin and bisphenol F type epoxy resin. Halogen-free process with the CCL (the electronics industry, especially in the consumer electronics industry is an inevitable trend of halogen-free), demand will have greatly improved, there may be in short supply. Major manufacturers are into the East, including Japan, DOW, South Asia (Taiwan).